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MS ELEMENT M315 kućište

MS ELEMENT M315 kućište, ATX/MATX/ITX, unutarnji 3.5"x2,unutarnji2.5"x3, USB 3.0 x2, USB 2.0 x1, cable management 21mm,dimenzije 395x198x415mm

48 KM
Dostupnost: 3 Dostupno

KUĆIŠTE MS ARMOR V745 GAMING

MS ARMOR V745 gaming kućište, ATX/mATX/ITX, unutarnji 3.5"/2,5" x2, USB 2.0 x2, USB 3.0 x1, 4 x 120mm ventilator, filter za prašinu, cable management 33mm, podržava vodeno hlađenje, dimenzije 453*235*450mm

117 KM
Dostupnost: 3 Dostupno

Kućište Gaming MS ARMOR V740

MS ARMOR V740 gaming kućište, ATX/mATX/ITX, unutarnji 3.5"/2,5" x2, USB 2.0 x2, USB 3.0 x1, 3 x 120mm ARGB ventilator, filter za prašinu, cable management 33mm, podržava vodeno hlađenje, dimenzije 453*235*450mm

110 KM
Dostupnost: 3 Dostupno

Spire Termalna pasta SP-700 0.5g

Thermal Impedance:<0.12CW, Thermal Conductivity:>2.93W/m-K, Colors: silver gray, Dimensions Injection tube: 55×8.5mm (wxd), G.W. Weight: 0.5 Gram, Specific Gravity: >1.7, Bleed:<0.05%, Dialectric Constant:>5.1(100Hz), Evaporation:<0.001%, Silicone Compounds: 50%m, Carbon Compounds: 30%, Metal Oxide Compounds: 20%, Application Thermal grease can be used on the rear side of the heatsink, Certifications ROHS, temperature of heating resist instantaneous: -50~240℃, Operation Temperture: -30~180℃

3 KM
Dostupnost: 10 Dostupno

Spire Termalna pasta SP-456 1g

Thermal Impedance: <0.067CW-in2/W, Thermal Conductivity: >3.8W/m-K, Colors Silver Grey, Dimensions Injection tube: 51x20x12mm (w x l x h), G.W. Weight: 1 Gram, Specific Gravity: >2.8, Bleed: <0.05%, Dialectric Constant: >5.1, Evaporation: 0.001%

4 KM
Dostupnost: 10 Dostupno

Pasta za CPU hladnjak GEMBIRD TG-G1.5-01

Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive Specifications Weight: 1.5 g Color: grey Thermal conductivity: > 4.5 W / mK Thermal Impedance 2.5 Evaporation:

5 KM
Dostupnost: 1000 Dostupno

Pasta za CPU hladnjak GEMBIRD TG-G3.0-01

Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive

6 KM
Dostupnost: 1000 Dostupno