Računari i komponente
Ovdje su 1541 proizvoda.
SSD Eksterni 1TB Samsung Portable T7 Shield...
SSD EXT 1TB, Sučelje USB 3.2, USB Type-C, 3D NAND, Brzina čitanja do 1.050,0000 Mb/s, Brzina zapisivanja do 1.000,0000 Mb/s, Software Samsung Portable SSD Software
Spire Termalna pasta SP-456 1g
Thermal Impedance: <0.067CW-in2/W, Thermal Conductivity: >3.8W/m-K, Colors Silver Grey, Dimensions Injection tube: 51x20x12mm (w x l x h), G.W. Weight: 1 Gram, Specific Gravity: >2.8, Bleed: <0.05%, Dialectric Constant: >5.1, Evaporation: 0.001%
Spire Termalna pasta SP-700 0.5g
Thermal Impedance:<0.12CW, Thermal Conductivity:>2.93W/m-K, Colors: silver gray, Dimensions Injection tube: 55×8.5mm (wxd), G.W. Weight: 0.5 Gram, Specific Gravity: >1.7, Bleed:<0.05%, Dialectric Constant:>5.1(100Hz), Evaporation:<0.001%, Silicone Compounds: 50%m, Carbon Compounds: 30%, Metal Oxide Compounds: 20%, Application Thermal grease can be used on the rear side of the heatsink, Certifications ROHS, temperature of heating resist instantaneous: -50~240℃, Operation Temperture: -30~180℃
CPU AMD Ryzen 5 5600GT
Ryzen 5 5600GT, AM4, Radni takt 3.600 MHz, L3 cache 16, TDP 65W, Hladnjak BOX, Integrirani grafički sustav Y, Grafički procesor Radeon Vega, Memory channel 2
MEM DDR4 32GB 3200MHZ XPG SPECTRIX D35G
XPG SPECTRIX D35G DDR4 32GB, Latencija CL16, Napajanje [V] 1,35, RGB ,sIntel® XMP 2.0,
SSD 2TB AD LEGEND 800 PCIe Gen4 M.2 2280
SSD 2TB AD ALEG-800, MTBF 1.500.000,0000, Kapacitet 2 TB, Sučelje M.2 PCIe 4.0 x4, m.2 2280, 3D NAND, Brzina čitanja do 3.500,0000 Mb/s, Brzina zapisivanja do 2.800,0000 Mb/s, Software ADATA SSD Toolbox
PC HP 290 G9 TWR Pro, 936Q1EAABB
290 G9 TWR E -R / 290 G9 E PCI IDS / i3-13100 / 8GB DDR4 / 512GB SSD / DOS / DVD-WR ODD / 1yw / 125 BLKkbd / 125mouse / P24v 23.8-in G5 / 2x USB2.0
Traxdata CD-R SLIM BOX 1 KOM
Format CD-R, Brzina 52x, Kapacitet [MB] 700, Pakiranje 1 komad slim box, Broj pakiranja u kutiji 200, Broj pakiranja na paleti 6800
Pasta za CPU hladnjak GEMBIRD TG-G1.5-01
Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive Specifications Weight: 1.5 g Color: grey Thermal conductivity: > 4.5 W / mK Thermal Impedance 2.5 Evaporation:
Thermal pad heatsink silicone GEMBIRD TG-P-01,...
Thermal pad heatsink silicone GEMBIRD TG-P-01, 100x100x1 mm