Računari i komponente

Filter po
Kategorije
Cijena
KM KM
Procesor
više... manje
Matična ploča
Grafika
Memorija
Pohrana
Kućište
Napajanje
Operativni sistem
Garancija
Filteri proizvoda
Brzi pregled

HP Pro Mini 260 G9 Desktop, 885B9EAABB

HP Pro Mini 260 G9 (885B9EA), kompaktno stolno računalo u Mini formatu, opremljeno 512GB PCIe NVMe SSD-om, 16GB DDR4 RAM memorije i Windows 11 Pro operativnim sustavom. Pokreće ga Intel Core i5-1335U procesor 13. generacije s do 4.6 GHz i Intel Iris Xe grafikom za pouzdan rad u poslovnim okruženjima. Zahvaljujući vrlo malim dimenzijama lako se uklapa na svaki radni stol, a istovremeno nudi bogatu povezivost uključujući USB-C, DisplayPort, HDMI, RJ-45 i više USB priključaka. Mogućnost proširenja memorije i pohrane, gigabitna mreža, priloženi HP miš te napredne sigurnosne funkcije s TPM 2.0 čine ga idealnim izborom za ured, administraciju i poslovne korisnike.

2.087 KM
Dostupnost: 3 Dostupno
Brzi pregled

HP ProDesk Tower 2 G1a R3-8300G 16GB512...

HP ProDesk 2 Tower G1a E AI: Ryzen 3 8300G, Radeon 740M, 16 GB DDR5, 512 GB NVMe SSD, Wi-Fi 6, Bluetooth 5.4, USB-C, HDMI, DisplayPort, FreeDOS, 2 DIMM utora, napajanje 280 W i jamstvo 1 godinu.

1.313 KM
Dostupnost: 3 Dostupno
Spire Termalna pasta SP-700...
Brzi pregled

Spire Termalna pasta SP-700 0.5g

Thermal Impedance:＜0.12CW, Thermal Conductivity:＞2.93W/m-K, Colors: silver gray, Dimensions Injection tube: 55×8.5mm (wxd), G.W. Weight: 0.5 Gram, Specific Gravity: ＞1.7, Bleed:＜0.05%, Dialectric Constant:＞5.1(100Hz), Evaporation:＜0.001%, Silicone Compounds: 50%m, Carbon Compounds: 30%, Metal Oxide Compounds: 20%, Application Thermal grease can be used on the rear side of the heatsink, Certifications ROHS, temperature of heating resist instantaneous: -50~240℃, Operation Temperture: -30~180℃

3 KM
Dostupnost: 10 Dostupno
Spire Termalna pasta SP-456 1g
Brzi pregled

Spire Termalna pasta SP-456 1g

Thermal Impedance: ＜0.067CW-in2/W, Thermal Conductivity: ＞3.8W/m-K, Colors Silver Grey, Dimensions Injection tube: 51x20x12mm (w x l x h), G.W. Weight: 1 Gram, Specific Gravity: >2.8, Bleed: ＜0.05%, Dialectric Constant: >5.1, Evaporation: 0.001%

4 KM
Dostupnost: 10 Dostupno
Pasta za CPU hladnjak...
Brzi pregled

Pasta za CPU hladnjak GEMBIRD TG-G1.5-01

Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive Specifications Weight: 1.5 g Color: grey Thermal conductivity: > 4.5 W / mK Thermal Impedance 2.5 Evaporation:

5 KM
Dostupnost: 19 Dostupno
Pasta za CPU hladnjak...
Brzi pregled

Pasta za CPU hladnjak GEMBIRD TG-G3.0-01

Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive

6 KM
Dostupnost: 19 Dostupno
Cooler Master Termalna...
Brzi pregled

Cooler Master Termalna Pasta HTK

HTK-002-U1-GP, Viskozitet: 1.400P (pri 25C), Termalna provodljivost: 4.5 W/m-K, Termalna impedansa: 0.02 C-in/W, Namjena: Za centralne (CPU) i grafičke procesore (GPU).

7 KM
Dostupnost: 10 Dostupno